High-yield quick-turn, prototype and production PCB assembly located in north Texas in the heart of the Dallas/Fort Worth tech sector. All QCG technicians and inspectors are certified to IPC-A-610, J-STD-001 and J-STD-001 with Space Addendum. We have extensive in-house PCB rework, modification and repair capabilities along with specialized expertise in BGA Reball and BGA Rework. This is an engineering friendly facility where customers are invited to set up shop for first article, source inspection, benchtop testing and prototyping on demand.

Technology

J-STD-001 Class 3
J-STD Space Addendum
IPC-A-610 Class 3
BGA, uBGA
Bump die
01005, 0201 standard
RoHS compliance
Selective Solder
Flying Probe Test
Functional Test
100% in-line AOI wet paste inspection
Ersascope

Quality

With process verification tools like in-line AOI wet paste inspection, Xray, Flying Probe Test and Ersacope you can build with confidence. QCG's systems and machines are fully integrated so that process engineers and quality inspectors have real time access defect trending, AOI results and Xray imaging.

Expertise

QCG technicians are experienced in hard to build technology and cutting-edge applications. Our skilled technicians are here to support your rapid prototyping and bench top modifications.

Serialized Data Tracking | Traceability | Electronic Travelers

QCG has developed a dynamic reporting layer for its ERP (Enterprise Resource Planning) system which enhances shop floor traceability and provides ultra-fast response time to engineering change notifications while product is in flow. Engineering changes are reviewed, approved and distributed straight to the production floor in a highly visible method with easy technician access to new instructions, drawings and data.

No Minimums Required

QCG is geared towards the engineer. We are built to bring your prototype build from QTY 1 to full production quantities.

Advanced Capabilities

QCG processes and equipment are capable of 0201 down to 01005 placements. We support ultra-fine pitch BGA and bump dies less than .2mm pitch with Xray inspected placements.